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1. product profile 1.1 general description ip3088cx5, IP3088CX10, ip3088cx15 and ip3088cx20 is a 2, 4, 6 and 8-channel lc low-pass filter array family which is design ed to provide filtering of undesired rf signals on the i/o ports of portable communication or computing devices. in addition, ip3088cx5, IP3088CX10, ip3088cx15 and ip3088cx20 incorpor ates diodes to provide protection to downstream components from electrostatic discharge (esd) voltages as high as 15 kv according iec 61000-4-2 level 4. the devices are fabricated using monolithic silicon te chnology and integrate and incorporate up to 16 coils and 24 diodes in a 0.5 mm pitch wafer-level chip-scale package (wlcsp). 1.2 features and benefits ? pb-free, rohs compliant and free of ha logen and antimony (dark green compliant) ? integrated 2, 4, 6 and 8-channel -type lc-filter network ? 18 channel series resistance; 45 pf (at 2.5 v dc) channel capacitance ? integrated esd protection withstanding 15 kv contact discharge, far exceeding iec 61000-4-2 level 4 ? esd protection to 30 kv contact discharge, per mil-std-883d, method 3 015 ? wlcsp with 0.5 mm pitch 1.3 applications ? cellular and personal communication system (pcs) mobile handsets ? cordless telephones ? wireless data (wan/l an) systems and pdas ip3088cx5; IP3088CX10; ip3088cx15; ip3088cx20 integrated 2, 4, 6 and 8-channel passive lc-filter network with esd protection to iec 61000-4-2 level 4 rev. 01 ? 12 february 2010 product data sheet
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 2 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection 2. pinning information 2.1 pinning 2.2 pin description fig 1. pin configuration ip3088cx5 fig 2. pin configuration IP3088CX10 fig 3. pin configuration ip3088cx15 fig 4. pin configuration ip3088cx20 001aak061 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 001aak06 2 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 b2 4 3 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 b2 4 3 001aak06 3 b3 6 5 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 b2 4 3 b3 6 5 001aak06 4 b4 8 7 table 1. pinning pin description ip3088cx5 IP3088CX10 ip3088cx15 ip3088cx20 a1 and c1 a1 and c1 a1 and c1 a1 and c1 filter channel 1 a2 and c2 a2 and c2 a2 and c2 a2 and c2 filter channel 2 - a3 and c3 a3 and c3 a3 and c3 filter channel 3 - a4 and c4 a4 and c4 a4 and c4 filter channel 4 - - a5 and c5 a5 and c5 filter channel 5 - - a6 and c6 a6 and c6 filter channel 6 - - - a7 and c7 filter channel 7 - - - a8 and c8 filter channel 8 b1 b1 and b2 b1, b2 and b3 b1, b2, b3 and b4 ground
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 3 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection 3. ordering information 4. functional diagram 5. limiting values [1] device is qualified with 1 000 pulses of 15 kv contact discharges each, according to the iec 61000-4-2 model and far exceeds the specified level 4 (8 kv contact discharge). table 2. ordering information type number package name description version ip3088cx5 wlcsp5 wafer level chip-size package; 5 bumps; 0.96 1.28 0.65 mm ip3088cx5 IP3088CX10 wlcsp10 wafer level chip-size package; 10 bumps; 1.96 1.28 0.65 mm IP3088CX10 ip3088cx15 wlcsp15 wafer level chip-size package; 15 bumps; 2.96 1.28 0.65 mm ip3088cx15 ip3088cx20 wlcsp20 wafer level chip-size package; 20 bumps; 3.96 1.28 0.65 mm ip3088cx20 fig 5. schematic diagram ip3088cx5; IP3088CX10; ip3088cx15; ip3088cx20 008aaa18 4 a1 to a8 b1 to b4 c1 to c8 table 3. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +5.6 v v esd electrostatic discharge voltage all pins to ground contact discharge [1] ? 15 +15 kv air discharge [1] ? 15 +15 kv iec 61000-4-2 level 4; all pins to ground contact discharge ? 8 +8 kv air discharge ? 15 +15 kv mil-std-883d (method 3 015) hbm contact discharge ? 30 +30 kv i ch channel current (dc) per inductor; t amb = 85 c - 30 ma t stg storage temperature ? 65 +150 c t amb ambient temperature ? 40 +85 c
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 4 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection 6. characteristics [1] guaranteed by design. 7. application information 7.1 insertion loss ip3088cx5, IP3088CX10, ip3088cx15 and ip3088cx20 is mainly designed as an electromagnetic interference (emi) and radi o frequency interference (rfi) filter for subscriber identity module (sim) card interfaces. the setup for measuring insertion loss in a 50 system is shown in figure 6 . table 4. channel characteristics t amb = 25 c; unless otherwise specified. symbol parameter conditions min typ max unit r s(ch) channel series resistance - 18 - l s(ch) channel series inductance - 40 - nh c ch channel capacitance v bias(dc) = 0 v; f = 100 khz [1] - 65 - pf v bias(dc) = 2.5 v; f = 100 khz [1] - 42 - pf v br breakdown voltage positive clamp; i test = 1 ma 5.8 - 10 v v f forward voltage negative clamp; i f = ? 1 ma ? 1.5 - ? 0.4 v i lr reverse leakage current per channel; v i = 3.5 v - - 0.1 a table 5. frequency characteristics t amb = 25 c; unless otherwise specified. symbol parameter conditions min typ max unit il insertion loss r gen = 50 ; r l = 50 800 mhz < f < 1.5 ghz - 40 - db 1.5 ghz < f < 3.0 ghz - 33 - db f ? 3db cut-off frequency r gen = 50 ; r l = 50 ; v bias(dc) = 0 v; il at 1 mhz ? 3 db - 175 - mhz fig 6. frequency response measurement configuration out 001aai75 5 50 50 v gen dut in test board
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 5 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection as an example, the measured insertion lo ss magnitude for all channels of the IP3088CX10 are shown in figure 7 . a. channel 1 (pins a1 and c1) b. channel 2 (pins a2 and c2) c. channel 3 (pins a3 and c3) d. channel 4 (pins a4 and c4) fig 7. measured insertion loss magnitude 001aak295 ? 30 ? 20 ? 40 ? 10 0 s 21 (db) ? 50 f (mhz) 110 4 10 3 10 10 2 001aak296 ? 30 ? 20 ? 40 ? 10 0 s 21 (db) ? 50 f (mhz) 110 4 10 3 10 10 2 001aak294 ? 30 ? 20 ? 40 ? 10 0 s 21 (db) ? 50 f (mhz) 110 4 10 3 10 10 2 001aak297 ? 30 ? 20 ? 40 ? 10 0 s 21 (db) ? 50 f (mhz) 110 4 10 3 10 10 2
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 6 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection 8. package outline fig 8. package outline ip3088cx20 (wlcsp20) wlcsp20_8-4-8_po european projection w lcsp20: wafer level chip-size package; 20 bumps (8-4-8) detail x a a 2 a 1 d e bump a1 index area e 2 e e 1 e 3 b 3 2 16 5 48 7 a b c 1/2 e x b1 b2 b3 b4 table 6. dimensions for figure 8 symbol min typ max unit a 0.60 0.65 0.70 mm a 1 0.22 0.24 0.26 mm a 2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm d 3.91 3.96 4.01 mm e 1.23 1.28 1.33 mm e - 0.5 - mm e 1 - 0.435 - mm e 2 - 0.87 - mm e 3 - 1.0 - mm
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 7 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection fig 9. package outline ip3088cx15 (wlcsp15) wlcsp15_6-3-6_po european projection w lcsp15: wafer level chip-size package; 15 bumps (6-3-6) detail x a a 2 a 1 d e bump a1 index area x e 2 e e 1 e 3 b 12 4 36 5 a b c 1/2 e b1 b2 b3 table 7. dimensions for figure 9 symbol min typ max unit a 0.60 0.65 0.70 mm a 1 0.22 0.24 0.26 mm a 2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm d 2.91 2.96 3.01 mm e 1.23 1.28 1.33 mm e - 0.5 - mm e 1 - 0.435 - mm e 2 - 0.87 - mm e 3 - 1.0 - mm
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 8 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection fig 10. package outline IP3088CX10 (wlcsp10) wlcsp10_4-2-4_po european projection w lcsp10: wafer level chip-size package; 10 bumps (4-2-4) detail x a a 2 a 1 x a b c e d e 2 e 1 b2 b1 bump a1 index area e b 4 3 e 3 2 1 1/2 e table 8. dimensions for figure 10 symbol min typ max unit a 0.60 0.65 0.70 mm a 1 0.22 0.24 0.26 mm a 2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm d 1.91 1.96 2.01 mm e 1.23 1.28 1.33 mm e - 0.5 - mm e 1 - 0.435 - mm e 2 - 0.87 - mm e 3 - 1.0 - mm
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 9 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection fig 11. package outline ip3088cx5 (wlcsp5) wlcsp5_2-1-2_po european projection w lcsp5: wafer level chip-size package; 5 bumps (2-1-2) detail x a a 2 a 1 x a b c e d 2 1 e 2 e 1 e b 1/2 e b1 bump a1 index area table 9. dimensions for figure 11 symbol min typ max unit a 0.60 0.65 0.70 mm a 1 0.22 0.24 0.26 mm a 2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm d 0.91 0.96 1.01 mm e 1.23 1.28 1.33 mm e - 0.5 - mm e 1 - 0.435 - mm e 2 - 0.87 - mm
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 10 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection 9. soldering of wlcsp packages 9.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 ?wafer level chip scale package? and in application note an10365 ?surface mount reflow soldering description? . wave soldering is not su itable for this package. all nxp wlcsp packages are lead-free. 9.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 9.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 12 ) than a pbsn process, thus reducing the process window ? solder paste printing issues, such as sm earing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature), and coo ling down. it is imper ative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 10 . moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 12 . table 10. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2 000 > 2 000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 11 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 9.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 9.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. 9.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again. msl: moisture sensitivity level fig 12. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 12 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because me tal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill remove d. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 ?surface mount reflow soldering description? . 9.3.4 cleaning cleaning can be done after reflow soldering. 10. abbreviations 11. revision history table 11. abbreviations acronym description dut device under test emi electromagnetic interference esd electrostatic discharge hbm human body model lan local area network pcb printed-circuit board pcs personal communication system pda personal digital assistant rfi radio frequency interference rohs restriction of hazardous substances sim subscriber identity module wan wide area network wlcsp wafer-level chip-scale package table 12. revision history document id release date data sheet status change notice supersedes ip3088cx5_cx10_cx15_cx20_1 20100212 product data sheet - -
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 13 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer?s third party customer(s) (hereinafter both referred to as ?application?). it is customer?s sole responsibility to check whether the nxp semiconductors product is suitable and fit for the application planned. customer has to do all necessary testing for the application in order to avoid a default of the application and the product. nxp semiconducto rs does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. non-automotive qualified products ? unless the data sheet of an nxp semiconductors product expressly states that the product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive sp ecifications and standards, customer (a) shall use the product without nx p semiconductors? warranty of the document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objec tive specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
ip3088cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 14 of 15 nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully in demnifies nxp semi conductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive appl ications beyond nxp semiconductors? standard warranty and nxp semicond uctors? product specifications. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors ip3088cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive lc-filter network with esd protection ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 12 february 2010 document identifier: ip3088cx5_cx10_cx15_cx20_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 application information. . . . . . . . . . . . . . . . . . . 4 7.1 insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 soldering of wlcsp packages. . . . . . . . . . . . 10 9.1 introduction to soldering wlcsp packages . . 10 9.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . 10 9.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 10 9.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . 11 9.3.3 rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.3.4 cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 10 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13 contact information. . . . . . . . . . . . . . . . . . . . . 14 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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